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Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Edwards is a leading developer and manufacturer of sophisticated vacuum products, abatement solutions and related value-added services. Our products are integral to manufacturing processes for semiconductors, flat panel displays, LEDs and solar cells; are used within an increasingly diverse range of industrial processes including power, glass and other coating applications, steel and other metallurgy, pharmaceutical and chemical; and for both scientific instruments and a wide range of R&D applications. Edwards is part of the Atlas Copco Group
Data Management Resources is a Torrance, CA-based company in the Computers and Electronics sector.
Ironwood Electronics creates innovative VLSI interconnect solutions in prototype, test, and production applications for Design and Development engineers.
Vitesse Semiconductor is a fabless supplier of high-performance integrated circuits (ICs), application software and integrated turnkey systems solutions used primarily in Carrier, Enterprise and industrial Internet of Things (IoT) network applications. With its corporate DNA in Carrier service provider networking, Vitesse has historically focused on both Carrier and Enterprise networking, selling into many of the leading OEMs that service these markets. Today, Vitesse is a leading supplier of ICs for next-generation Ethernet-based Carrier, Enterprise, and IoT networks worldwide. We design, develop and market a diverse portfolio of high-performance, feature-rich, low-power and cost-competitive Ethernet networking and connectivity IC solutions, associated applications and protocol software. For over 30 years, Vitesse has been a leading innovator in networking and connectivity solutions, leading adoption of new technologies in Carrier and Enterprise networking. Many of the technologies Vitesse developed for Carrier and Enterprise networking are highly synergistic in emerging adjacent markets, such as the industrial Internet of Things (IoT), automotive, storage and other networks converging on Ethernet. Vitesse continues leading the forefront to enable diverse networking industries to make the transition from legacy to standards-based, ubiquitous "Ethernet Everywhere" networking.