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Vishay Intertechnology, Inc. is one of the world`s largest manufacturers of discrete semiconductors and passive electronic components. Vishay has manufacturing plants in Israel, Asia, Europe, and the Americas where it produces rectifiers, diodes, MOSFETs, optoelectronics, selected integrated circuits, resistors, capacitors, and inductors. Vishay Intertechnology revenues for 2011 were $2.594 billion.
Smith is the leading independent distributor of electronic components and ranks sixth among all global distributors. As a pioneer in the electronics distribution marketplace, Smith has spent nearly 40 years developing its customer-focused business model. Driven by customer demand and market forces, Smith acquires, tests, and distributes products required by our customers. In 19 cities around the world, Smith`s legion of employees communicates in 50 languages and dialects and buys and sells components 24 hours per day, generating global annual sales in excess of $4.7 billion in 2022. Smith is a leading supplier of semiconductors, CPUs, memory, integrated circuits, peripheral devices, networking equipment and other electronic components. Smith representatives have deep product knowledge and market expertise.
NEXX Systems is a Billerica, MA-based company in the Computers and Electronics sector.
Polar Instruments is a Beaverton, OR-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.