| Name | Title | Contact Details |
|---|---|---|
Frank Egitto |
Director of Research and Development | Profile |
ASSET InterTech is a Richardson, TX-based company in the Computers and Electronics sector.
PRECILAB is a Carrollton, TX-based company in the Computers & Electronics sector.
Cirrus Logic is a leader in high performance, low-power ICs for audio and voice signal processing applications. Cirrus Logic`s products span the entire audio signal chain, from capture to playback, providing innovative products for the world`s top smartphones, tablets, digital headsets, wearables and emerging smart home applications. With headquarters in Austin, Texas, Cirrus Logic is recognized globally for its award-winning corporate culture. Check us out at www.cirrus.com. Founded in 1984, Cirrus Logic excels at developing complex chip designs where feature integration and innovation is a premium. Cirrus Logic has more than 2,100 patents that are key to our more than 700 products serving more than 2,500 end customers globally, through both direct and distributor-based channel sales. The company`s headquarters are in Austin, Texas, with international locations in Europe, China and Japan.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Test Edge is a San Diego, CA-based company in the Computers & Electronics sector.