| Name | Title | Contact Details |
|---|---|---|
Kenneth Reilich |
Vice President of Sales | Profile |
CMC Materials, Inc., headquartered in Aurora, Illinois, is a leading global supplier of consumable materials primarily to semiconductor manufacturers. The company`s products play a critical role in the production of advanced semiconductor devices, helping to enable the manufacture of smaller, faster and more complex devices by its customers. CMC Materials, Inc. is also a leading provider of performance materials to pipeline operators. The company`s mission is to create value by delivering high-performing and innovative solutions that solve its customers` challenges. The company has approximately 2,200 employees globally.
GeneSiC Semicondcutors is a Sterling, VA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company`s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, plasma etching tools, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence.
Screen Americas (Rolling Meadows, Illinois), a SCREEN Graphic and Precision Solutions group company, provides a wide range of solutions to meet graphic communications needs, with a strong focus on production-class inkjet printing technology. Since 1967, Screen Americas has created satisfied customers by delivering the latest innovations that help diverse printing operations profitably grow their businesses. Our versatile, reliable product portfolio includes Truepress inkjet printers and presses, PlateRite thermal platesetters and PDF/JDF-based workflow solutions for computer-to-plate and print-on-demand. Screen digital solutions are known for their ability to streamline printing processes and significantly improve output quality. These exceptional features continue to make them leaders in their respective market segments. Exciting new advances in every product category, along with ongoing product improvements and software upgrades, offer greater value and flexibility. Whether you specialize in commercial printing, book publishing, direct mail, packaging, labels or wide-format signs and displays, our core technology and specialist knowledge will match your production needs with the right hardware and software to get the job done.