| Name | Title | Contact Details |
|---|
Palomar Technologies, Inc. is a Carlsbad, CA-based company in the Computers & Electronics sector.
CMC Materials, Inc., headquartered in Aurora, Illinois, is a leading global supplier of consumable materials primarily to semiconductor manufacturers. The company`s products play a critical role in the production of advanced semiconductor devices, helping to enable the manufacture of smaller, faster and more complex devices by its customers. CMC Materials, Inc. is also a leading provider of performance materials to pipeline operators. The company`s mission is to create value by delivering high-performing and innovative solutions that solve its customers` challenges. The company has approximately 2,200 employees globally.
Complete Automation is a Lake Orion, MI-based company in the Computers & Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Xeal is a technology-first electric vehicle (EV) charging company operating at the intersection of mobility, real estate, IoT, and energy. We are building the next generation of EV charging solutions to take the market from 1% to 100% mass adoption. We tackle the world`s greatest challenges with disruptive, yet practical solutions for the built environment and future of smart cities. Xeal has been adopted by the nation`s largest real estate companies to electrify thousands of parking spaces.