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Coffey Engineering is a Laramie, WY-based company in the Telecommunications sector.
CTC Union Technologies Co. is a Ambler, PA-based company in the Telecommunications sector.
Airspan is a U.S.-based provider of groundbreaking, disruptive software and hardware for 5G networks, and a pioneer in end-to-end Open RAN solutions that are interoperable with other vendors. As a result of our innovative technology and significant R&D investments to build and expand our 5G solutions portfolio, Airspan is well positioned with Open RAN, private networks, fixed wireless access (FWA), and CBRS solutions, providing solutions to tier 1 mobile network operators to deploy their networks of the future, today. With over one million cells shipped to 1,000 customers in more than 100 countries, Airspan has global scale.
NeoPhotonics is a leading provider of photonic integrated circuit-based modules, components and subsystems for use in optical communications networks. Our products, and those produced by our customers, are used by telecommunications and cable service providers to deploy advanced networks for video, voice and other data services at high data transmission rates and low costs. Our photonic integrated circuits (PICs) combine hundreds of photonic devices on one silicon substrate, thereby dramatically reducing cost and size and increasing reliability and power efficiency. We design and manufacture PICs using our planar lightwave technology and our micro-electrical-mechanical device (MEMS) technology, along with our nanoscale design, materials, fabrication and metrology. The NeoPhotonics™ PIC technology is a key enabler for meeting today`s optical communications market demands. Just as electronic integrated circuits displaced discrete electronic devices, dramatically reducing costs while increasing reliability, thus enabling the electronics revolution of recent decades, an analogous advance in photonics is gathering momentum using photonic integrated circuits. This photonics technology transformation similarly allows dramatic increases in functionality within component-level products.
Telecommunication Manufacturing