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Saringer Life Science Technologies Inc. is a Oakville, ON-based company in the Healthcare, Pharmaceuticals, & Biotech sector.
Affinity Biologicals Inc. is a Ancaster, ON-based company in the Healthcare, Pharmaceuticals, & Biotech sector.
Amedica Corporation is ISO 13485 certified, and its products are FDA and CE approved. Amedica Corporation is an emerging orthopaedic implant company focused on using its silicon nitride ceramic technologies to develop and commercialize a broad range of innovative, unique spine and total joint implants for the growing orthopaedic device market.
We are one of the world`s leading suppliers of processing solutions to the ophthalmic and precision-optical industry. SCHNEIDER innovations set the pace – in freeform generating and polishing of eye glasses, in grinding and polishing of precision aspheres, and in process metrology. We set technical standards and open up new and more productive solutions to our customers. We are distinctive for our development of new technologies and swift translation of technological concepts into customer-oriented innovations.
Promex, located in Silicon Valley, is an ISO 13485:2003 Medical and ISO 9001:2008 certified microelectronics, semiconductor & advanced packaging and high reliability SMT/PCBA contract assembly service provider for the medical & bioscience, commercial and military markets. Core competencies allow the sequential steps of prototypes, new product introductions & beta production, followed by volume manufacturing. Complete in-house microelectronics process capabilities and process expertise uniquely integrates SMT / PCBA with microelectronics assembly. Facilities include Class 100 and Class 1000 clean rooms, RoHS optimized SMT/PCBA lines, plus development & assembly areas. ISO 13485 Medical process verification and validation using IQ, OQ, PQ and pFMEA practices and extensive use of statistical process controls. Complete Microelectronics Assembly Process Flows: • Wafer handling and sawing including 300 mm wafers • Fully automatic die attach • Wire bonding (Au ball, Al wedge, RF ribbon & wedge, Cu) • Plastic over molding (multi-chip modules, arrays, system-in-package) • Precision materials dispense • Encapsulation • Flip Chip High Reliability SMT/PCBA and Chip-on-Substrate: RoHS optimized SMT lines allow single facility process integration. Leaded solder processing also available. Chip-on-Substrate expertise. IPC-A-610 Class 3 assembly. Consigned and full turnkey SMT/PCBA and supply chain management. Quality Systems (Medical): FDA Title 21 Part 820 compliance ensures device history files, operator training records, IQ, OQ, PQ and process documentation meet all standards.