| Name | Title | Contact Details |
|---|---|---|
Ben Hawthorne |
Director, CFO Special Projects | Profile |
Karen Courter |
Managing Director, HR Shared Services Leader and HR4HR | Profile |
John Hautala |
Sr. Director R&D | Profile |
Marc Major |
Research and Development Manager | Profile |
Werner Finsterbusch |
Vice President Sales and Customer Experience, Specialty Technologies | Profile |
Sumer Incorporated is a Rolling Meadows, IL-based company in the Computers and Electronics sector.
Renesas Electronics Corporation delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live—securely and safely. Business operations began as Renesas Electronics in April 2010 through the integration of NEC Electronics Corporation (TSE:6723) and Renesas Technology Corp., with operations spanning research, development, design and manufacturing for a wide range of applications. With Intersil`s (NASDAQ:ISIL) integration in February 2017, it has boosted Renesas` portfolio to include a wider range of high performance precision analog, mixed-signal and power management solutions that no other are able to offer, making us a world class provider of the three solutions: Device, Kit & Platform. Renesas Electronics is headquartered in Japan, with subsidiaries in 20 countries worldwide. A global leader in microcontrollers, analog, power and SoC products, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of Automotive, Industrial, Home Electronics (HE), Office Automation (OA) and Information Communication Technology (ICT) applications to help shape a limitless future.
Nuvation Research Corp is one of the leading companies in the Computers & Electronics sector.
Micro Strategy is a Vienna, VA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.