| Name | Title | Contact Details |
|---|
VinChip Systems Inc is a San Jose, CA-based company in the Computers and Electronics sector.
Foxconn Corporation,Hon Hai Precision Industry Co., Ltd is one of the leading companies in the Computers and Electronics sector.
Princeton Infrared Technologies, Inc. (PIRT) is focused on supplying Shortwave Infrared detectors to both the commercial and defense markets. PIRT is a fabless semiconductor company focusing on design and integration. The products will be manufactured by leveraging more established semiconductor fabrication facilities to produce products in quantity with high quality at low cost. This model is used through the semiconductor industry, but not in the infrared detector business. In the past the infrared imaging industry had no commercial foundries to manufacture the “exotic” materials used to produce IR detectors, but that today is no longer true. Now that fabrication facilities can manufacture infrared parts, our fabless model will lead to much lower cost and improved devices for both the defense and the commercial sectors. Also, leveraging advance Silicon CMOS technologies enables PIRT to gain the advantages of technology developed for the commercial arena. Having the fabrication conducted at an outside foundry allows PIRT to concentrate on design of the product, managing the process, and conducting final assembly, which minimizes the equipment and staff needed, thus overhead costs. This is the model used by almost all modern electronic manufacturers.
Vanguard EMS is a Beaverton, OR-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.